World leader in advanced component solutions Samsung Electronics Co., Ltd. has announced the release of new line-up of chip scale package (CSP) LED modules for spotlights and downlights.
Aside from featuring colour tunability, the new LED modules come with a combination of advanced flip chip and phosphor coating technology which eliminates metal wires and plastic melds to enable more compact designs when manufacturing LED modules and fixtures.
“Our new CSP LED modules provide an optimal solution for lighting manufacturers who seek highly compatible and reliable LED components,” said Jacob Tarn, Executive Vice President, LED Business Team at Samsung Electronics.
“Samsung will continue to strengthen its CSP technology leadership and spearhead new innovations in LED component technology to bring greater value to our customers.”
Available in two form factors (19x19mm or 28x28mm), the LED modules are highly convenient in assembling and provide high-quality lighting in diverse beam angle options – spot, medium and wide.